SNU PRECISION
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Core Technology

The advanced technology of SNU Precision is opening the future.

Business Area

  • Display Equipment
  • Photo Spacer Inspection System

    Introduction Accurate step height measurement in RGB process
    Feature
    • Non-contact 3D surface measurement
    • Nanoscale resolution, high-speed measurement
    Measurement item PS/Bump height and RGB step, COA Via Hole Depth and Step, Overlay, etc.
    Application Height and CD measurement of display TFT/CF/CELL process, Other fields requiring high-precision 3D surface shape measurement
  • Critical Dimension Measure System

    Introduction Measurement of various line widths in the exposure pattern process
    Feature
    • Non-contact linewidth measurement
    • Nano-level resolution, high-speed measurement
    • 3D CD measurement possible by combining with 3D lens
    Measurement item Overlay、Hole、PR、Metal、ITO Slit CD
    Application TFT Photo process, TFT PECVD process, Other fields requiring high-precision 2D surface CD measurement
  • Critical Dimension Measure System

    Introduction Halftone and CD are simultaneously measured to optimize process conditions such as exposure amount, coating amount, and etching amount in LCD process
    Feature
    • Simultaneous measurement of CD / thickness / height in one measurement
    • Nano-level resolution, high-speed measurement
    Measurement item Half tone thickness、Overlay、Hole、PR、Metal、ITO Slit width
    Application TFT Photo process、TFT PECVD process、PI thickness measurement of Flexible TFT substrate
  • Glass Particle Inspection System

    Introduction Inspection equipment to minimize mask damage that may occur during LCD close exposure
    Feature
    • Able to install on existing conveyor line
    • Above 100 um particle detection
    Application Exposure process
  • Non-contact 3D surface shape Measurement system (SIS-1200 plus)

    Introduction Equipment for research/analysis based on non-contact 3D surface measurement principle
    Feature
    • Non-contact 3D surface shape measurement
    • Nanoscale resolution
    Measurement item 3D step profile, thin film thickness, CD measurement, etc.
    Application Research/analysis fields that require precise 2,3D step profile, thickness, line width, etc. measurements
  • Non-contact 3D surface shape Measurement system (SIS-2000)

    Introduction Equipment for research/analysis based on non-contact 3D surface measurement principle
    Feature
    • Non-contact 3D surface shape measurement
    • Nanoscale resolution
    • Motorized 6 position indexing turret
    • Motorized X, Y, Z, Tip/Tilt
    Measurement item 3D step profile, thin film thickness, CD measurement, etc.
    Application Research/analysis fields that require precise 2,3D step profile, thickness, line width, etc. measurements
  • OLED Evaporation System (Helisys)

    Introduction Organic/Inorganic material deposition system in vacuum which fabricates high quality of Mono, Full Color OLED Device
    Feature
    • Good deposition uniformity
    • Precise Align accuracy
    • Equipment line-up from R&D ~ Mass production
    Application OLED Vacuum Deposition Process
  • OLED Thin Film Encapsulation (TFE)

    Introduction Encap deposition equipment that performs organic material deposition process during TFE whole process
    Feature
    • Good deposition uniformity
    • Precise Align accuracy
    • Equipment line-up from R&D ~ Mass production
    Application OLED Flexible Encapsulation Process
  • Wafer Evaporation System

    Introduction Si wafer-based deposition system that can produce OLEDos (OLED on Silicon) for VR, AR, MR, and XR implementation in the metaverse era
    Feature
    • Deposition source for Real RGB OLEDoS
    • High precision align system for wafer
    • Equipment line-up from 200mm&300mm Si Wafer
    Application OLEDoS Vacuum Deposition Process