SNU PRECISION
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Core Technology

The advanced technology of SNU Precision is opening the future.

Business Area

  • Semiconductor/PCB Equipment
  • Nano Scan Inspection System

    Introduction
    • 3D surface shape measurement using white light interferometry principle
    • Step and CD measurement of micropatterns
    Feature
    • Non-contact 3D surface shape measurement
    • Sub-nanoscale vertical resolution, high-speed measurements
    Measurement item PS Line/space step and line width, hole depth and size
    Application PS substrate(FC BGA, FC CSP), MLB, plating/circuit/PSR process of PLP substrate
  • Bump Inspection System

    Introduction
    • 3D surface shape measurement using white light interferometry principle
    • Step and CD measurement of micropatterns
    Feature
    • Non-contact 3D surface shape measurement
    • Sub-nanoscale vertical resolution, high-speed measurements
    Measurement item Bump height and size, surface flatness, etc.
    Application bumping process of semiconductor packaging
  • Superior Auto Optical Inspection

    Introduction Inspection equipment that optically grasps the external appearance of an object and judges whether or not it is acceptable by image processing
    Feature
    • Stable inspection of microcircuits is possible
    • High-precision real-time linewidth measurement
    Inspection item disconnection, short, defect, protrusion, space, pad, u-short, edge space/missing/protrusion, pinhole, VH defect/open/eccentric/none, residual, hole eccentric/open/defect/none, Narrow, Wide, etc.
    Application semiconductor post-processing, packaging process, PS substrate, etc.
  • Dual Verification Review System

    Introduction Equipment that takes a specific image by receiving the coordinates of the substrate defect location determined by AOI
    Feature
    • Can check fine line width
    • Provides high-resolution, clear images
    • Reduced inspection time with ultra-fast motion
    • Configurable product entry/exit logistics automation
    Application Process that requires review after AOI/AVI in the semiconductor/PCB field
  • Mini/Micro LED Laser Reflow

    Introduction A device that uses laser technology to bond only the bonding area under optimal conditions
    Feature
    • Minimize substrate damage through selective laser reflow
    • Rapid temperature rise and tact time implementation
    • Implementation of Fine Pitch Package through various Beam Sizes
    • Large area, line beam applicable
    • Excellent temperature uniformity, high reproducibility
    • Real-time monitoring of process status is possible
    Application semiconductor, LED, secondary battery, etc.